Manufacturer
AMD
CYPRESS
CYPRESS SEMICONDUCTOR
FUJITSU
MICROCHIP
PANASONIC
RAMTRON
ST MICROELECTRONICS
Access Time-Max
105
110
140
55
70
80
85
Additional Feature
SRAM IS ORGANISED AS 512K X 8 OR 256K X 16
SRAM IS ORGANISED AS 512MB
IHS ObjectID
102090025
1280966370
1280966371
1280966372
1280966373
1280966375
1280966376
1280966377
1280966378
1280966379
1280966380
1280966381
1283427180
1283427181
1283427182
1283427183
1285200154
1285200155
1285200157
1291288116
1291288117
1292889852
1292889853
1294445113
1294445114
1294445115
1294445116
1294445121
1294445122
1295427619
1295427620
1299288412
1299288414
1299288415
1308265777
1308265778
1308265784
1308265786
1308265789
1308265790
1308265791
1308265792
1308265794
1308265797
1308265798
1308265799
1308265800
1308265802
1315838813
1315838814
1315838815
1315838817
1322445646
1322445647
1322445648
1322445652
1474459992
1480231775
1480231776
1480231779
1481692893
1481692896
1481692898
1481692900
1481692901
1496918936
1496918937
1503439530
1503439531
1543152483
1678814480
1678814481
1831662229
1831662230
2114935721
4001773499
8057530361
8058375407
8058375408
8101365625
8143287006
8157705009
8157722100
8157722101
8233105086
8233105105
8314280907
8314280908
JESD-30 Code
R-PBGA-B48
R-PBGA-B69
R-PDSO-G14
R-PDSO-G16
R-PDSO-G28
R-PDSO-G32
R-PDSO-G44
R-PDSO-G8
R-PDSO-N8
S-XQCC-N16
JESD-609 Code
e0
e1
e3
e4
Length
10.2
11
11.8
17.9
18.41
18.415
3
4.4
4.5
4.88
4.889
4.9
5.28
6
8
8.64
9.893
Memory Density
1048576
131072
16384
16777216
2048
2097152
262144
4096
4194304
524288
5312
65536
8192
Memory IC Type
MEMORY CIRCUIT
Memory Width
1
16
8
Mixed Memory Type
FLASH+SRAM
N/A
Moisture Sensitivity Level
1
2
3
Number of Functions
1
Number of Terminals
14
16
28
32
44
48
69
8
Number of Words
1048576
131072
16384
2048
256
262144
32768
4096
512
524288
65536
664
8192
Number of Words Code
128K
16K
1M
256
256K
2K
32K
4K
512
512K
64K
664
8K
Operating Mode
ASYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125
85
Operating Temperature-Min
-25
-40
Organization
128KX16
128KX8
16KX8
1MX16
256KX16
256KX8
256X8
2KX1
2KX8
32KX8
4KX1
512KX8
512X8
64KX1
64KX8
664X8
8KX1
8KX8
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
HVSON
LFBGA
SOP
SSOP
TFBGA
TSOP1
TSOP2
TSSOP
VQCCN
Package Equivalence Code
BGA48,6X8,30
BGA69,10X10,32
SOLCC8,.16,37
SOP28,.4
SOP8,.25
TSOP44,.46,32
TSSOP32,.56,20
Package Shape
RECTANGULAR
SQUARE
Package Style
CHIP CARRIER, VERY THIN PROFILE
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
SMALL OUTLINE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Power Supplies
2.5/3.3
3
3.3
3/3.3
43164
5
Qualification Status
Not Qualified
Screening Level
AEC-Q100
Seated Height-Max
.6
0.6
0.8
0.85
1.194
1.2
1.4
1.727
1.75
2
2.03
2.65
2.67
Standby Current-Max
0.00015
0.00027
1e-05
3e-05
5e-05
5e-06
6e-06
Sub Category
Other Memory ICs
SRAMs
Supply Current-Max
0.0003
0.0004
0.001
0.002
0.003
0.004
0.008
0.012
0.015
0.045
Supply Voltage-Max (Vsup)
3.3
3.6
3.65
5.25
5.5
Supply Voltage-Min (Vsup)
1.8
2
2.4
2.7
3
4.5
Supply Voltage-Nom (Vsup)
3
3.3
5
Surface Mount
YES
Technology
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
OTHER
Terminal Finish
Matte Tin (Sn)
Nickel/Palladium/Gold (Ni/Pd/Au)
PURE TIN
Tin (Sn)
Tin/Lead (Sn/Pb)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
GULL WING
NO LEAD
Terminal Pitch
.5
.65
0.5
0.65
0.75
0.8
0.95
1.27
Terminal Position
BOTTOM
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
20
30
40
NOT SPECIFIED
Width
10.16
2
3
3.89
3.898
3.8985
3.9
4
5
5.23
5.3
6
7.5
8